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450 1 pc1 22f 2 5 7 8 6 34 k2m ag s k 15 goy ordering code ;my applications ??y features y ~ ?p
q %?;mz?
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qu?m y ???vu??o ?^m y
i?0?u??o ?^m ??a?? spark gaps operating temp. k 30 vj 85 c ag ??a?? ? ? y6 6 l??y?0) [ v ] 4 8 f g h j l m 500 m 800 m 1000 m 2000 m 2000 1000 ??? y [ mm ] h3d l3n k2m k2u k4m k4u qqq y h ????? ??? k ????? k ????? k ????? k ????? ??? (40 ?? 6.4 6.4 5.0 5.0 6.4 6.4 13 ?^ 5.0 m 0.8 24 ? 20 ? 5.0 m 1 20 ? 5.0 m 1 24 ? 0.65 0.65 0.60 0.60 0.60 0.60 1.0 2 ? y 10 ?
go?w?? 15 y 20 y 40 y p ???? % 3 %p? 5 ? ?l????y [ vdc ] 76 a
y crt *%w? ?yu ) q = ?? q e 10 z 20 ??o ? f >g? g s e 15 ??o ? f >g? g b e 15 ??a?e?? ? qq 40 ??o ? f >g? g yy q = ?? q %???s` c %??? ? 122 1200 492 4900 y very safe due to self-extinguishing resin y leakage current is very small. y electrostatic capacitance is very small. y used to absorb abnormal voltages in the periphery of a crt ag spark gaps type coating conditions 6 4 8 lead configuration [ mm ] h3d l3n k2m k2u k4m k4u qqq lead type h-formed straight k-formed k-formed k-formed k-formed straight (40 type) lead space 6.4 6.4 5.0 5.0 6.4 6.4 13 length 5.0 m 0.8 24min. 20min. 5.0 m 1 20min. 5.0 m 1 25min. diameter 0.65 0.65 0.60 0.60 0.60 0.60 1.0 2 external dimension 10 15 y 20 y 40 y p alkyd resin 3 resin material 76 packaging q e type 10,20 bulk y s e type 15, bulk b e type 15, taped qq type 40, bulk q =blank space q without resin cap c with resin cap 1 type by external dimension 122 1200 492 4900 n ominal discharge starting voltage [ vdc ] discharge voltage tolerance [ v ] f g h j l m 500 m 800 m 1000 m 2000 m 2000 1000 q =blank space 5 1
451 7 surge absorbers p.451 ??aa part numbers ?
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$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions p.452 p.453 p.454 p.456 ?3???? selection guide p.12 etc ?
goy external dimensions h ????? formed h3d ag20 ag15 k ????? formed k2m,k2u,k4m,k4u ag10 ??? straight l3n ??? straight l3n type ???
lead type ag40 ??? straight qqqf ?? g y blank space ??aay part numbers y w g tx ? ? y6ztxl????yz r tx?0)z?txa
ztx??? yg?u???b{ g please specify the coating condition code and z the discharge starting voltage code and r the tolerance code and g the packaging code and i the lead configuration code. f ? g ?;`om?p?x~ ?p
q %pz ul94v-0 z ul1410 f phase ll f
m g ?- ab??wpb{ note d the material used is a self-extinguishing resin conforming to ul94v-0 and ul1410 f phase ll regulation g yyy i 1 ag10 z ag15 z ag20 x dc500v20 ?ow?pb{ yyy ag40 x dc1000v20 ?ow?pb{ ?.w^ thickness of body d 4 m 0.5 ?.w^ thickness of body d 4 m 0.5 ?.w^ thickness of body d 4 m 0.5 unit d mm f inch g e ? t y capless ? t y ? v capped ?.w^ thickness of body d 3 m 0.5 ?.w^ thickness of body d 3.5max f 0.118 m 0.020 gf 0.138max g f 0.157 m 0.020 g f 0.157 m 0.020 g f 0.157 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g ?.w^ thickness of body d 4 m 0.5 f 0.157 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g i 1 values of ag10,ag15,ag20 are set at dc500v within 20 seconds. values of ag40 is set at dc1000v within 20 seconds. y type l????y discharge starting voltage f dc g ? ?? nominal value [ v ] 4000 y 4900 1200 y 1500 y 2000 2500 1200 y 1500 y 2000 2500 6000 y 7000 y 8000 y 9000 ?0) tolerance [ v ] m 800 z m 1000 m 500 m 800 m 500 m 800 m 2000
? ? insulation resistance [ m e ] i 1 10000min 10000min 10000min 10000min ??? y lead configuration ??? straight k ????? k formed ???z h ????? straight ,h formed ??? straight m 2000 1000 ag10p g r e l3n ag15p g r g e ag20p g r e ag40p g r
452 ?
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$y electrical characteristics
451 7 surge absorbers p.451 ??aa part numbers ?
q
$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions p.452 p.453 p.454 p.456 ?3???? selection guide p.12 etc ?
goy external dimensions h ????? formed h3d ag20 ag15 k ????? formed k2m,k2u,k4m,k4u ag10 ??? straight l3n ??? straight l3n type ???
lead type ag40 ??? straight qqqf ?? g y blank space ??aay part numbers y w g tx ? ? y6ztxl????yz r tx?0)z?txa
ztx??? yg?u???b{ g please specify the coating condition code and z the discharge starting voltage code and r the tolerance code and g the packaging code and i the lead configuration code. f ? g ?;`om?p?x~ ?p
q %pz ul94v-0 z ul1410 f phase ll f
m g ?- ab??wpb{ note d the material used is a self-extinguishing resin conforming to ul94v-0 and ul1410 f phase ll regulation g yyy i 1 ag10 z ag15 z ag20 x dc500v20 ?ow?pb{ yyy ag40 x dc1000v20 ?ow?pb{ ?.w^ thickness of body d 4 m 0.5 ?.w^ thickness of body d 4 m 0.5 ?.w^ thickness of body d 4 m 0.5 unit d mm f inch g e ? t y capless ? t y ? v capped ?.w^ thickness of body d 3 m 0.5 ?.w^ thickness of body d 3.5max f 0.118 m 0.020 gf 0.138max g f 0.157 m 0.020 g f 0.157 m 0.020 g f 0.157 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g ?.w^ thickness of body d 4 m 0.5 f 0.157 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g ?.w^ thickness of body d 3 m 0.5 f 0.118 m 0.020 g i 1 values of ag10,ag15,ag20 are set at dc500v within 20 seconds. values of ag40 is set at dc1000v within 20 seconds. y type l????y discharge starting voltage f dc g ? ?? nominal value [ v ] 4000 y 4900 1200 y 1500 y 2000 2500 1200 y 1500 y 2000 2500 6000 y 7000 y 8000 y 9000 ?0) tolerance [ v ] m 800 z m 1000 m 500 m 800 m 500 m 800 m 2000
? ? insulation resistance [ m e ] i 1 10000min 10000min 10000min 10000min ??? y lead configuration ??? straight k ????? k formed ???z h ????? straight ,h formed ??? straight m 2000 1000 ag10p g r e l3n ag15p g r g e ag20p g r e ag40p g r
453 7 surge absorbers ay packaging a j
:? standard quantity type ag10 ag15 ag20 ag40 >g? bulk 500 1000 500 200 a?e?? taped ------ 1300 f a j
:?y standard quantity [ pcs ] t k2m ??w? g? symbol a b t p p 0 p 1 p 2 f w w 0 w 1 w 2 h h 0 b d 0 l b t q h1 q h2 d 6.8 m 0.5 f 0.268 m 0.020 g 7.0 m 0.5 f 0.276 m 0.020 g 4.0 m 0.5 f 0.157 m 0.020 g 12.7 m 1.0 f 0.500 m 0.039 g 12.7 m 0.3 f 0.500 m 0.012 g 3.85 m 0.5 f 0.152 m 0.020 g 6.35 m 1.3 f 0.250 m 0.051 g 5.0 m 0.5 f 0.197 m 0.020 g 18.0 f 0.709 g y 12.0min f 0.472min g 9.0 f 0.354 g 3.0max f 0.118max g 19.6 m 0.5 f 0.772 m 0.020 g 16.0 m 0.5 f 0.630 m 0.020 g 4.0 m 0.3 f 0.157 m 0.012 g 11.0max f 0.433max g 2.0max f 0.079max g 0.75 m 0.2 f 0.030 m 0.008 g 2.0max f 0.079max g 0.6 m 0.05 f 0.024 m 0.002 g
go dimensions j 0.039 k 0.020 j 0.75 k 0.5 j 1.0 k 0.5 j 0.030 k 0.020 a?e??
goy f k2m ?? g y taping dimensions f k2m type g t available for k2m type only unit d mm f inch g ------ ------
455 7 surge absorbers reliability data spark gaps specified value item test methods and remarks 1.operating temperature y range 2.operating humidity range 3.storage temperature y range 4.discharge voltage 5.insulation resistance 6.capacitance 7. discharge y life 8. damp heat 9.terminal y strength tensile torsional no damage no damage 1000m e 1000m e k 30 cvj 85 c 95%rh max. f no dew condensation g k 40 cvj 85 c within the specified tolerance 10,000 m e min. 1pfmax. with circuit 1 shown below, conduct measurement with voltage application. applied voltage d 500vdc f ag10 z ag15 z ag20 g 1000vdc f ag40 g duration d within 20 sec. measuring frequency d 1 m 0.1mhz measuring voltage d 0.5 v 5.0vrms bias application d none with the circuit 2 shown below, repeat discharge with specified voltage, followed by the measurement within 2 to 5 hrs. number of discharge d 10,000 times f ag10 z ag15 z ag20 g yyyy d 5,000 times f ag40 g temperature d 40 m 2 c humidity d 90 v 95 l rh duration d 250 hrs recovery d 2 to 5 hrs of recovery under the standard condition after the removal from test chamber. apply the tensile force in the direction to draw terminal. applied force d 9.8n f ag10 z ag15 z ag20 g d 39.2n f ag40 g apply the bending force to incline the body to right and left through angle of 90 applied force d 4.9n f ag10 z ag15 z ag20 g d 9.8n f ag40 g circuit 2 circuit 1 ag10 z ag15 z ag20 ag40 yy r d 20m e z 20m e z 5m e yy c d 3000pf z 10000pf z 3000pf yy e d refer to individual specification yy ag10 z ag15 z ag20 ag40 yy r d 20m e z 5m e yy c d 2000pf z 3000pf note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 c of temperature, 45 to 85% relative humidity and 86 to 106kpa of air pressure. when there are questions concerning measurement results: in order to provide correlation data, the test shall be conducted under condition of 20 m 2 c of temperature, 60 to 70% relative humidity and 86 to 106kpa of air pressure. unless otherwise specified, all the tests are conducted under the "standard condition." l l 5000m e ag10 ag15 z ag20 z ag40 5000m e ll discharge voltage change insulation resistance discharge voltage change insulation resistance 1/1 k 30 j 70 k 30 j 70 k 35 j 20 k 30 j 50
precautions 457 7 surge absorbers 1/2 technical considerations stages precautions precautions on the use of spark gaps 1. circuit design s verification of operating environment, electrical rating and per- formance 1. a malfunction in medical equipment, spacecraft, nuclear re- actors, etc. may cause serious harm to human life or have severe social ramifications. as such, any spark gaps to be used in such equipment may require higher safety and/or reli- ability considerations and should be clearly differentiated from components used in general purpose applications. s verification of rated voltage (dc rated voltage) s operating environment precautions 1. capacitors should not be used in the following environments: (1)environmental conditions to avoid a. exposure to water or salt water. b. exposure to moisture or condensation. c. exposure to corrosive gases (such as hydrogen sulfide, sulfu- rous acid, chlorine, and ammonia) 2. pcb design 1. when spark gaps are mounted onto a pc board, hole dimen- sions on the board should match the lead pitch of the compo- nent, if not it will cause breakage of the terminals or cracking of terminal roots covered with resin as excess stress travels through the terminal legs. as a result, humidity resistance performance would be lost and may lead to a reduction in insulation resistance and cause a withstand voltage failure. 3. considerations for automatic insertion s adjustment automatic insertion machines (leaded components) 1. when inserting spark gaps in a pc board by auto-insertion machines the impact load imposed on the capacitors should be minimized to prevent the leads from chucking or clinching.
precautions 459 7 surge absorbers 4. soldering s selection of flux 1. when soldering spark gaps on the board, flux should be ap- plied thinly and evenly. 2. flux used should be with less than or equal to 0.1 wt% (equiva- lent to chroline) of halogenated content. flux having a strong acidity content should not be applied. 3. when using water-soluble flux, special care should be taken to properly clean the boards. s wave soldering 1.temperature, time, amount of solder, etc. are specified in y accordance with the following recommended conditions. 2. do not immerse the entire spark gaps in the flux during the soldering operation. only solder the lead wires on the bottom of the board. 1. flux is used to increase solderability in wave soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. to mini- mize the amount of flux applied, it is recommended to use a flux-bubbling system. 2. with too much halogenated substance (chlorine, etc.) content is used to activate the flux, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the capacitors. 3. since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of capacitors in high humidity conditions may cause a degrada- tion of insulation resistance and therefore affect the reliability of the components. the cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. 1. if spark gaps are used beyond the range of the recommended conditions, heat stresses may cause cracks inside the spark gaps, and consequently degrade the reliability of the spark gaps. 5. cleaning s board cleaning 1. when cleaning the mounted pc boards, make sure that clean- ing conditions are consistent with prescribed usage conditions. 1. the resin material used for the outer coating of capacitors is occasionally a wax sub- stance for moisture resistance which can easily be dissolved by some solutions. so before cleaning, special care should be taken to test the component? vulnerability to the solutions used. when using water-soluble flux please clean the pcb with purified water sufficiently and dry thoroughly at the end of the process. insufficient washing or drying could lower the reliability of the capacitors. 6. post-cleaning-process s application of resin molding, etc. to the pcb and components. 1. please contact your local taiyo yuden sales office before per- forming resin coating or molding on mounted capacitors. please verify on the actual application that the coating pro- cess will not adversely affect the component quality. 2/2 1-1. the thermal expansion and coefficient of contraction of the molded resin are not neces- sarily matched with those of the spark gaps. the spark gaps may be exposed to stresses due to thermal expansion and contraction during and after hardening. this may lower the specified characteristics and insulation resistance or cause reduced with- stand voltage by cracking the ceramic or separating the coated resin from the ceramics. 1-2. with some types of mold resins, the resin's decomposition gas or reaction gas may remain inside the resin during the hardening period or while left under normal condi- tions, causing a deterioration of the capacitor's performance. 1-3. some mold resins may have poor moisture proofing properties. please verify the contents of the resins before they are applied. 1-4. please contact taiyo yuden before using if the hardening process temperature of the mold resins is higher than the operating temperature of the spark gaps. technical considerations stages precautions precautions on the use of spark gaps s mechanical considerations 1. be careful not to subject the spark gaps to excessive me- chanical shocks. withstanding voltage failure may result. 2. if spark gaps are dropped onto the floor or a hard surface they should not be used. 1. because the spark gaps is made of ceramic, mechanical shocks applied to the board may damage or crack the spark gaps. 2.spark gaps which are dropped onto the floor or a hard surface may develop defects and have a higher risk of failure over time. 7. handling 1. under high temperature/high humidity conditions, the decrease in solderability due to the oxidation of terminal electrodes and deterioration of taping and packaging character- istics may be accelerated. s storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. hu- midity should especially be kept as low as possible. recom- mended conditions: ambient temperature below 40 c humid- ity below 70% rh. products should be used within 12 months after delivery. after the above period, the solderability should be checked before using the spark gaps. 2. spark gaps should not be kept in an environment filled with decomposition gases such as (sulfurous hydrogen, sulfurous acid, chlorine, ammonia, etc.) 3. spark gaps should not be kept in a location where they may be exposed to moisture, condensation or direct sunlight. 8. storage conditions

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